Software has been developed in collaboration with Microsemi Corp. of Aliso Viejo, CA and supported by funding from US Air Force. Bruce Odekirk, SiC Program Director at the Microsemi manufacturing facility in Bend, Oregon, commented: "We have been early adopters of nSPEC® for SiC epitaxial wafer inspection, and our first Nanotronics tool has been producing highly informative data for over a year. Now we are delighted to extend its ability to monitor and improve our post-epi chip processing with equally great performance and cost-effectiveness."
Ivan Eliashevich, VP at Nanotronics Imaging, added: "nSPEC®'s versatility in image acquisition and state-of-the-art data processing power allow us to deliver exceptionally broad range of testing capabilities by adding new software-driven features to existing tool platforms. Instead of bearing the expense of buying multiple tools, dealing with data compatibility issues etc., customers now can have multiple functions seamlessly combined in one affordable machine."
Commercial release of the patterned wafer inspection software for new and existing nSPEC® systems is expected in Q1 2013, it is currently available for evaluation as a beta version.
Contacts: Microsemi (+1 541-382-8028) Press/technical: Dr. Bruce Odekirk Nanotronics Imaging (+1 330 926 9809) ###